It is generally believed that for RFID to get wide acceptance in the marketplace the cost must go down to a level of 5 cents per RFID tag or lower. This severely limits the die size of a tag IC and thus only very basic functions can be realized in the tag IC. However, newer generations of fabrication technologies with sub-100nm feature sizes bring new opportunities for the tag IC as more functions can be implemented within the same size. In this project, the development of the tag IC in 90nm technology will be explored.